Thin Film Foundry


Thin Film Microwave Integrated Circuit Fabrication Service


MATERIAL:
  • Alumina (AI,O,) 99.6% Asfied and Polished surface finishes
  • 010", .015", .020", and .025" thicknesses in stock
Other materials in stock
Please call us to discuss your application

METALIZATION:

  • A Side: TaN ... 50 or 1OO Ohms per square
    TlW....... 500 Angstroms ± 20%
    Au........ Per Your specification up to 200 micro inches ± 20%
  • B Side: TIW....... 500 Angstroms ± 20%
    Au........ Per your specification up to 200 micro inches ± 20%

VIAS:

  • Metalized via holes. Minimum aspect ratio of 0.8:1.0 (e.g. .012" thick substrate).
  • Metalized slots - can be used to allow wrap-around processing in array.

MASKS:

  • Can be generated from artwork, rubylith, Autocad, Micad, or GDS II files

DELIVERY:

  • Three weeks ARO for non-via circuits. Quantity may be limited.
  • Premium Delivery is available

STANDARD DIMENSION REQUIREMENTS:

Minimum line width: 0.0008"


Minimum Gap: 0.0004"


 Maximum AU Thickness: 200 micro inches


Minimum distance from edge of circuit for conductor geometries: 0.0002"


Minimum distance from edge of circuit for resistor geometries: 0.002"

STANDARD TOLERANCES:

  • Minimum linewidrth tolerances:" ± 0.0001"
  • Linewidth tolerance on all non-critical areas: =0.0005"
  • Metal thickness tolerance: ± 20%
  • Integrated resistor tolerance: ± .002"
  • Circuit size tolerance: ± .002"
    (Tighter tolerances available upon request.)


To obtain a complete copy of our Thin Film Design Guide or for more Information, please contact us at (510) 770-2350


Thin Film Foundry Product Portfolio


Home | Company Profile | Amplifiers | DLVA | Catalog | Employment | Contact Menlo